Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement

ABSTRACT

In a method for producing a sensor arrangement and the resulting sensor arrangement, a sensor is provided on or in a chip and the chip is covered with a protective cover, the cover being an interface between the sensor and the environment. An adhesive layer is provided between the chip and the protective cover, the adhesive layer alone or together with the protective cover being an interface between the sensor and the environment. The protective cover and/or the adhesive layer may have a channel formed therein, the channel functioning as the reception channel for a sensor. In an alternative embodiment, the protective cover placed on a wafer with several chips, and the wafer is cut up to produce the individual chips with the protective cover. Thus, a sensor arrangement may have the protective cover applied to the individual chip after the chip is cut from the wafer, or the protective cover may be applied to the wafer, and the wafer and cover are then cut up into the individual chips and corresponding covers. The channel leading from one side of the arrangement to the sensor may be taken through the adhesive layer, through the protective cover, or through both. A hole may be formed in the protective cover above the sensor, with the sensor lying loosely in the hole. The reaction volume may be determined by the dimensions of the hole.

BACKGROUND OF THE INVENTION

The present invention relates in general to sensors, and in particular to a sensor arrangement and a method for producing such a sensor arrangement.

A method for producing a sensor arrangement and the corresponding sensor arrangement are known from published patent application WO 0143181 A1. In this known arrangement, a sensor, such as a chemical sensor, a micro-mirror array, an acceleration sensor, or an optoelectronic sensor, is arranged on a substrate or chip, and is covered with a protective cover. The protective cover is arranged at a distance from the sensor by means of spacers, so that a cavity sealed off from the outside is formed between the protective cover and the sensor.

However, in this known sensor arrangement, the advantage of a chip and sensor totally screened off from the outside is countered by the disadvantage that parameters of liquids or gases can no longer be measured or determined by means of the sensor, because the sensor is not accessible to gases and liquids.

What is needed is a sensor arrangement, and a method for producing same, such that the chip, with the sensor disposed on or in the chip, and its electrical connections, on the one hand, are safely screened off from the outside, but on the other hand the sensor remains freely accessible.

SUMMARY OF THE INVENTION

In a method for producing a sensor arrangement and the resulting sensor arrangement, at least one sensor is provided on or in a chip and the chip is covered with a first protective cover, the cover being an interface between the sensor and the environment. In the alternative, an actuator instead of a sensor may be provided on a chip. Nevertheless, it is to be understood that as used herein, the term sensor also includes an actuator. An adhesive layer may be provided between the chip and the first protective cover, the adhesive layer alone or together with the first protective cover being an interface between the sensor and the environment. The protective cover and/or the adhesive layer may have a channel formed therein, the channel functioning as the reception channel for a sensor or as the transmission channel for an actuator. This channel, which may run lateral to the surface of the chip, leads to the sensor from one side of the arrangement.

An alternative embodiment has the first protective cover placed on a wafer with several chips, and the wafer is cut up to produce the individual chips with the protective cover. Thus, a sensor arrangement may have the protective cover applied to the individual chip after the chip is cut from the wafer, or the protective cover may be applied to the wafer, and the wafer and cover are then cut up into the individual chips and corresponding covers.

In one embodiment, the channel leading from one side of the arrangement to the sensor is taken through the adhesive layer.

In a second embodiment, the channel leading from one side of the arrangement to the sensor is taken through the protective cover.

In a third embodiment, the channel leading from one side of the arrangement to the sensor is taken through both the adhesive layer and the protective cover.

A further embodiment includes a hole in the protective cover above the sensor, with the sensor lying loosely in the hole. The reaction volume may be determined by the dimensions of the hole. In this embodiment, the channel leads from one side of the chip to the hole.

A further embodiment includes at least one inlet hole and at least one outlet hole formed in the protective cover, the holes being joined together by at least one channel. In this case, a sensor may be arranged to be freely accessible. For example, the inlet hole and the outlet hole can be joined together by three channels. A sensor may be arranged in each channel. The sensors placed in the three channels may work totally independent of each other. Here, the reaction volume may be defined by the channels, as well as the inlet and the outlet holes.

A further embodiment calls for the protective cover to be transparent to light; for example, it can be an optical filter, an optical waveguide, or an optical lens.

The protective cover may protect the connection points of the chip against a medium being investigated, e.g., a corrosive gas or a corrosive liquid.

A further embodiment includes additional, yet removable protective covers on the first protective cover, which added covers may also be configured as an interface between the sensor and the environment.

These and other objects, features and advantages of the present invention will become more apparent in light of the following detailed description of preferred embodiments thereof, as illustrated in the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a first embodiment of a sensor arrangement;

FIG. 2 is a perspective view of a second embodiment of a sensor arrangement;

FIG. 3 is a perspective view of a third embodiment of a sensor arrangement;

FIG. 4 is a perspective view of a fourth embodiment of a sensor arrangement;

FIG. 5 is a section through the fourth embodiment of FIG. 4;

FIG. 6 is a perspective view of a fifth embodiment of a sensor arrangement;

FIG. 7 is a perspective view of a sixth embodiment of a sensor arrangement;

FIG. 8 is a top view of a seventh embodiment of a sensor arrangement;

FIG. 9 is a perspective view of an eighth embodiment of a sensor arrangement; and

FIG. 10 is an exploded view of a ninth embodiment of a sensor arrangement.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIG. 1, on a chip 20, in which a sensor 22 for example is embedded or is formed on, a protective cover 24 is glued by a layer of a bonding agent 26. In the bonding layer 26, a continuous channel 28 is made, in which the sensor 22 of the chip 20 lies so as to be freely accessible. Through the channel 28, a liquid or gaseous medium, for example, can flow and can be sensed by the sensor 22. The protective cover 24 can be transparent to light, for example, so that the reaction space above the sensor 22 can be observed. The channel 28 may determine the reaction volume. Since the channel 28 has a height corresponding to the thickness of the bonding layer, the bonding layer 26 alone may be structured. This embodiment therefore may be particularly easy to produce.

In the embodiment of FIG. 2, the channel 28 is taken through the protective cover 24, whereas in the embodiment of FIG. 3 it is taken through both the bonding layer 26 and the protective cover 24.

Referring to a fourth embodiment is illustrated in FIG. 4, just as in the first embodiment in FIG. 1, a protective cover 24 is glued by a bonding agent 26 onto a chip 20, in which a sensor 22 is embedded or formed on. A hole 30 is made in the protective cover 24 above the sensor 22, so that the sensor 22 is accessible from above through the hole 30. The channel 28 can be taken through the bonding layer 26, through the protective cover 24, or both. A gaseous or liquid medium, for example, can flow through the hole 30 and the channel 28.

In FIG. 5, a section through the fourth embodiment is illustrated. For example, an optical filter 32 sits atop the sensor 22, which is embedded in or formed on the chip 20.

In FIG. 6, a fifth embodiment of the invention is illustrated. A protective cover 24 is glued by a bonding agent 26 onto a chip 20 with a sensor 22. A channel 28 runs through the protective cover 24 and the bonding layer 26 from one side to the opposite side. Also, a hole 30 is made in the protective cover 24 from above. The channel 28 and the hole 30 intersect. At the point of intersection of the channel 28 and the hole 30, a sensor 22 of the chip 20 is placed. As in the preceding embodiments, the reaction volume may be defined by the hole 30 and the channel 28. For example, to observe the reaction volume, the protective cover 24 may be made from a material transparent to light, such as glass. The channel 28 can also be taken only through the bonding layer 26, for example, or only through the protective cover 24.

FIG. 7 illustrates a sixth embodiment of the invention in perspective view. On a chip 20, a protective cover 24 is glued by a bonding agent 26, in which an inlet hole 34 and an outlet hole 36 are made. The inlet hole 34 and the outlet hole 36 are joined together via a channel 28 in the protective cover 24 and in the bonding layer 26, in which a sensor 22 of the chip 20 lies. For example, a gaseous or liquid medium can stream or flow into the inlet hole 34 and from there via the channel 28 to the outlet hole 36, where it again streams or flows out. The inlet hole 34, the channel 28 and the outlet hole 36 may determine the reaction volume. To observe the reaction volume from all sides, the protective cover 24 may comprise a transparent material, such as glass.

In FIG. 8, a seventh embodiment is illustrated in top view. As in the preceding embodiments, a protective cover 24 is glued by a bonding agent 26 onto a chip 20. As in the seventh embodiment in FIG. 8, an inlet hole 34 and an outlet hole 36 are made in the upper side of the protective cover 24. The holes 34, 36 are joined together via a first, second and third channels 28. In each channel 28, a sensor 22 of the chip 20 is arranged. Various sensors 22 and actuators can also be combined and arranged in the channels 28. The seventh embodiment is not, however, limited to one inlet hole 34, one outlet hole 36, and three channels 28. The number of inlet holes 34, outlet holes 36, and channels 28 is optional. In the seventh embodiment as well in the other embodiments, the reaction volumes may be defined by the channels 28 and the holes 34, 36. For better observation of the reaction volumes, the protective cover 24 can be made from a material transparent to light, such as glass.

In FIG. 9, an eighth embodiment is illustrated in perspective view. A glass substrate 40, on whose underside are arranged first contacts 42 (e.g., land grid array pads), is glued by a bonding agent 26 by its upper side onto the lower side of a chip 20, on whose upper side are arranged second contacts 44 (e.g., bond pads), which are connected via connections 46 to the land grid array pads 42. Onto the upper side of the chip 20, a protective cover 24 is glued by a bonding agent 26. In the upper side of the protective cover 24, a hole 30 is made, at the bottom of which there is a sensor 22 of the chip 20. The reaction volume may be defined by the hole 30. For better observation of the reaction volume, the protective cover 24 may comprise a material transparent to light, such as glass.

In FIG. 10, a ninth embodiment of the invention is illustrated in exploded view. On the upper side of a chip 20 or a silicon wafer, a first protective cover 24 is glued by a bonding agent 26, in whose upper side a hole 30 is made, which leads to a sensor 22 arranged on the chip 20 or the silicon wafer. A channel 28 leads from one side of the arrangement to the hole 30. The channel 28, as in the other embodiments, can be taken only through the bonding layer 26, only through the first protective cover 24, or through both. On the lower side of the chip 20 or the silicon wafer, contact points 42 are arranged. On the upper side of the first protective cover 24 there is applied a coating seal 50, on which is placed a second removable protective cover 52, which is bounded by the reaction volume formed by the hole 30. The second protective cover 52 may comprise a material transparent to light, so that the reaction volume can be well observed. For example, the second protective cover 52 can be an optical filter to beam light with a defined frequency into the reaction volume.

The sensors 22 can be chemical sensors, mechanical sensors, acceleration sensors, or optoelectronic sensors, such as photodiodes, for example. The actuator can be, for example, a light emitting diode.

In the foregoing embodiments, the electrical contacts and the chip are securely protected, yet parameters of a liquid or a gas can be measured or determined by the sensor 22.

The number of holes 30, 34, 36 and channels 28 made in the protective cover 24 is optional. Any given combinations of holes and channels can be realized, which can be joined together, but need not necessarily be so.

Although the present invention has been shown and described with respect to several preferred embodiments thereof, various changes, omissions and additions to the form and detail thereof, may be made therein, without departing from the spirit and scope of the invention. 

1. A method for producing a sensor arrangement, where a sensor is provided with a chip, the chip is covered with a first protective cover, a bonding layer between the chip and the first protective cover being provided, a channel to the sensor is provided, and the channel is taken at least partly laterally to the surface of the chip.
 2. The method of claim 1, wherein a plurality of the chips are arranged on a wafer, a sensor is provided with each of the plurality of chips, and the wafer is covered with a first protective cover.
 3. The method of claim 1, where the channel is taken from one side of the arrangement to the sensor.
 4. The method of claim 1, where the channel is taken through the bonding layer.
 5. The method of claim 12, where the channel is taken through the first protective cover.
 6. The method of claim 14, where the channel is taken through the bonding layer and through the first protective cover.
 7. The method of claim 16, where a hole is made in the first protective cover and the bonding layer above the sensor, and where the sensor lies loosely in the hole.
 8. The method of claim 1, where an inlet hole and an outlet hole are made in the first protective cover, the inlet and outlet holes being joined together by at least one channel, and where the sensor lies freely accessible in the channel.
 9. The method of claim 7, where the reaction volume is defined at least in part by the hole.
 10. The method of claim 1, where the first protective cover is transparent to light.
 11. The method of claim 1, where the first protective cover is an optical filter.
 12. The method of claim 1, where the first protective cover is an optical waveguide.
 13. The method of claim 1, where the first protective cover is an optical lens.
 14. The method of claim 1, where the first protective cover protects contacts in the form of bond pads of the chip, against a medium being investigated.
 15. The method of claim 14, where a removable second protective cover is placed on the first protective cover.
 16. The method of claim 15, where the second removable protective cover is an interface between the sensor and the outside environment.
 17. The method of claim 15, where the second removable protective cover comprises a material transparent to light.
 18. The method of claim 1, where first electrical contacts of the chip are arranged on an underside of the chip and connected via connections across sides of the chip, to second electrical contacts arranged on an upper side of the chip.
 19. The method according to of claim 18, where the contacts on the underside of the chip comprise land grid array pads and the contacts on the upper side of the chip comprise bond pads.
 20. A sensor arrangement, comprising a chip having a sensor associated therewith, the chip being covered with a first protective cover, the first protective cover being adhered to the chip by a bonding layer, and a channel to the sensor being provided, where the channel is taken at least partly laterally to the surface of the chip.
 21. The sensor arrangement of claim 20, where a plurality of the chips are arranged on a wafer, a sensor being provided with each of the plurality of chip, and where the wafer is covered with a first protective cover.
 22. The sensor arrangement of claim 20, where the channel is taken from one side of the arrangement to the sensor.
 23. The arrangement of claim 20, where the channel is taken through the bonding layer.
 24. The arrangement of claim 20, where the channel is taken through the first protective cover.
 25. The arrangement of claim 20, where the channel is taken through the bonding layer and through the first protective cover.
 26. The arrangement of claim 20, where the first protective cover and the bonding layer has a hole formed therein, the hole being located above the sensor.
 27. The arrangement of claim 20, where the first protective cover has an inlet hole and an outlet hole formed therein, the holes being joined together by a channel.
 28. The arrangement of claim 20, where the reaction volume is defined at least in part by the hole.
 29. The arrangement of claim 20, where the first protective cover is transparent to light.
 30. The arrangement of claim 20, where the first protective cover is an optical filter.
 31. The arrangement of claim 20, where the first protective cover is an optical waveguide.
 32. The arrangement of claim 20, where the first protective cover is an optical lens.
 33. The arrangement of claim 20, further comprising electrical contacts bond pads associated with the chip, where the first protective cover protects the bond pads against a medium being investigated.
 34. The arrangement of claim 20, where first electrical contacts of the chip are arranged on an underside of the chip and are connected by connections taken across sides of the chip, to second electrical contacts arranged on an upper side of the chip.
 35. The arrangement of claim 34, where the contacts on the underside of the chip comprise land grid array pads and the contacts on the upper side of the chip comprise bond pads.
 36. The arrangement of claim 20, further comprising a removable second protective cover placed on the first protective cover.
 37. The arrangement of claim 36, where the second removable protective cover operable as an interface between the sensor and the outside environment.
 38. The arrangement of claim 36, where the second removable protective cover comprises a material transparent to light.
 39. A method for producing a sensor arrangement, comprising the steps of: providing a chip having a sensor associated therewith; affixing a protective cover to the chip using a bonding layer; and providing a channel so that the sensor is exposed by the channel to an environment external to the sensor arrangement.
 40. The method of claim 39, wherein the step of providing a channel further comprises the step of providing the channel in the bonding layer.
 41. The method of claim 39, wherein the step of providing a channel further comprises the step of providing the channel in the protective cover.
 42. The method of claim 39, wherein the step of providing a channel further comprises the step of providing the channel in the bonding layer and in the protective cover.
 43. The method of claim 39, wherein the step of providing a channel further comprises the step of providing the channel in an orientation that is at least partly lateral to a surface of the chip.
 44. The method of claim 39, further comprising the step of forming a hole in the protective cover and in the bonding layer where the sensor is accessible through the hole.
 45. The method of claim 39, further comprising the step of forming an inlet hole and an outlet in the protective cover and in the bonding layer, the inlet and outlet holes being connected by at least one channel. 